A chip-scale integrated cavity-electro-optomechanics platform

TY - JOUR

T1 - A chip-scale integrated cavity-electro-optomechanics platform

AU - Winger, M.

AU - Blasius, T. D.

AU - Mayer Alegre, T. P.

AU - Safavi-Naeini, A. H.

AU - Meenehan, S.

AU - Cohen, J.

AU - Stobbe, Søren

AU - Painter, O.

PY - 2011/12/5

Y1 - 2011/12/5

N2 - We present an integrated optomechanical and electromechanical nanocavity, in which a common mechanical degree of freedom is coupled to an ultrahigh-Q photonic crystal defect cavity and an electrical circuit. The system allows for wide-range, fast electrical tuning of the optical nanocavity resonances, and for electrical control of optical radiation pressure back-action effects such as mechanical amplification (phonon lasing), cooling, and stiffening. These sort of integrated devices offer a new means to efficiently interconvert weak microwave and optical signals, and are expected to pave the way for a new class of micro-sensors utilizing optomechanical back-action for thermal noise reduction and low-noise optical read-out.

AB - We present an integrated optomechanical and electromechanical nanocavity, in which a common mechanical degree of freedom is coupled to an ultrahigh-Q photonic crystal defect cavity and an electrical circuit. The system allows for wide-range, fast electrical tuning of the optical nanocavity resonances, and for electrical control of optical radiation pressure back-action effects such as mechanical amplification (phonon lasing), cooling, and stiffening. These sort of integrated devices offer a new means to efficiently interconvert weak microwave and optical signals, and are expected to pave the way for a new class of micro-sensors utilizing optomechanical back-action for thermal noise reduction and low-noise optical read-out.

M3 - Journal article

SN - 1094-4087

VL - 19

SP - 24905

EP - 24921

JO - Optics Express

JF - Optics Express

IS - 25

ER -